If you are looking for a challenging and exciting career in the world of technology, then look no further. Skyworks is an innovator of high performance analog semiconductors whose solutions are powering the wireless networking revolution. At Skyworks, you will find a fast-paced environment with a strong focus on global collaboration, minimal layers of management and the freedom to make meaningful contributions in a setting that encourages creativity and out-of-the-box thinking. Our work culture values diversity, social responsibility, open communication, mutual trust and respect. We are excited about the opportunity to work with you and glad you want to be part of a team of talented individuals who together can change the way the world communicates.

Requisition ID: 69519

Responsibilities

• Develop package level mechanical finite element models to characterize internal stress/strain in packages due to various package assembly related processes to ensure high yield.
• Develop mechanical models to characterize the stress/strain and useful lifetime of the packages due to reliability test conditions and 2nd level testing conditions.
• Develop thermal models to characterize the package level thermal resistance parameters such as Theta j-a, Theta j-c, Theta j-b, Psi j-t etc.
• Document all simulation models, codes and scripts and present the results to broader team.
• Work with material suppliers and vendors and with material testing labs to characterize relevant material properties as needed for modeling.

Qualifications

• Excellent knowledge in fundamentals of solid mechanics, heat transfer and materials science.
• Experience using FEM tools such as ANSYS (APDL & Workbench), ABAQUS, FLOTHER, ICEPAK or other similar tools.
• Experience with IC packaging modeling & simulation, and packaging failure analysis.
• Experience in simulating IC packaging assembly steps such as die attach, wire-bonding, over-molding, materials curing and reliability testing conditions such as drop/shock, thermal cycling, cyclic bend etc.
• Experience in simulation and characterization of IC packaging thermal resistance parameters as defined in JEDEC standards.
• Good understanding of various electronic packaging technologies (SiP, MCM, WLCSP, Dual-sided packages etc.), structures and processes.
• Any experience with materials testing/characterization and thermal testing is a plus.
• Must have excellent verbal and written communication skills and presentation skills.
• Well versed in use of Microsoft Office tools.
• Mechanical Engineering degree required – B.S. with 8+ years experience, M.S. with 6+ years experience or Ph.D. with 3+ years experience is preferred.

Skyworks is an Equal Opportunity Employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, age, sex, sexual orientation, gender identity, national origin, disability, protected veteran status, or any other characteristic protected by law.

Job Type: Full-time

Benefits:

• 401(k)
• 401(k) matching
• Dental insurance
• Employee assistance program
• Employee discount
• Flexible schedule
• Flexible spending account
• Health insurance
• Health savings account
• Life insurance
• Paid time off
• Parental leave
• Professional development assistance
• Referral program
• Relocation assistance
• Retirement plan
• Tuition reimbursement
• Vision insurance

Schedule:

• 8 hour shift

Work Location: In person

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