NXP’s CTO organization plays an essential role in the company’s success by ensuring the delivery of high quality, scalable, cost-competitive technologies and supply to create a competitive advantage for our customers.

The Packaging Innovation (PI) organization in CTO is responsible for the implementation of packaging solutions for new product introduction and new technology development for electronic packages for the varied business product lines; Automotive (analog, sensors and microcontrollers), Security & Connectivity and Digital Networking.

Job Summary:

• Define and validate package designs, materials and processes used for development of new products for NXP. Develop DOE’s and tests to evaluate suitability and reliability of package solutions. Work with the Business Lines, Product Engineering, Marketing, Quality teams to understand product requirements and provide package solutions.
• Collaborate with NXP internal assembly sites and OSATs to qualify product package solutions.
• Manage the package process using industry standard project management tools.
• Develop solutions by working closely with Package Innovation teams (Design, Materials, Modeling (electrical/thermal/mechanical) and Package Processing).
• Address and solve materials and processing issues that may occur during the development process.
• May involve international travel to package assembly sites and NXP suppliers.

Job Qualifications:

• Bachelors, M.S. or PhD in Materials Science, Mechanical Engineering, Chemical Engineering or Electrical Engineering
• Up to 2 years work experience, including internships
• Team player with positive attitude, self-driven, with excellent communication and presentation skills (both written and verbal) are required.
• Knowledge of Statistical Analysis and Design of Experiment is a plus.
• Ability to work in a dynamic fast-paced environment, flexible and capable of adapting to changes while collaborating with teams at engineering and management levels, both globally and locally
• Knowledge of various IC packages like QFP, QFN, BGA, FCBGA, FCCSP, WLCSP and FOWLP is a plus.
• Knowledge of IC packaging materials, characterization methods etc. is a plus.
• Knowledge of IC package and packaging material reliability failure modes is a plus.

NXP is an Equal Opportunity/Affirmative Action Employer regardless of age, color, national origin, race, religion, creed, gender, sex, sexual orientation, gender identity and/or expression, marital status, status as a disabled veteran and/or veteran of the Vietnam Era or any other characteristic protected by federal, state or local law. In addition, NXP will provide reasonable accommodations for otherwise qualified disabled individuals.